Wafer edge inspection

Details Wafer edge inspection Wafer edge inspection

2007-01-09

2007-01-09

Rosenberger, Richard A. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

11365221

ABSTRACT:
In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.

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