Wafer dryer and method for drying a wafer

Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent

Reexamination Certificate

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C034S078000, C034S080000

Reexamination Certificate

active

11075872

ABSTRACT:
A wafer dryer and method featuring a nebulizer which emits a pressurized drying liquid stream that converges with an opposed pressurized non-reactive carrier gas stream to produce a drying liquid fog. The pressurized non-reactive gas spray device is disposed partially within a tub and partially within a wafer bath vessel housing a wafer to be dried. The tub has a vent port for allowing the drying liquid fog to pass into the wafer bath vessel to adhere to exposed wafer surfaces and displace remaining liquid on wafer surfaces, thus drying the wafer. The tub may further include a drain for draining drying liquid not converted into the fog or which has condensed. The vent also may include means for retaining larger drying liquid fog particles which allows smaller drying liquid fog particles to pass into the wafer bath vessel.

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patent: 2002/0176931 (2002-11-01), Goseki et al.

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