Electric heating – Metal heating – By arc
Reexamination Certificate
2008-02-05
2010-12-28
Heinrich, Samuel M (Department: 3742)
Electric heating
Metal heating
By arc
C219S121690, C219S121830, C438S463000
Reexamination Certificate
active
07858902
ABSTRACT:
A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.
REFERENCES:
patent: 3448510 (1969-06-01), Johnson, Jr. et al.
patent: 6136668 (2000-10-01), Tamaki et al.
patent: 7129150 (2006-10-01), Kawai
patent: 2006/0110894 (2006-05-01), Ueda et al.
patent: 2000-182995 (2000-06-01), None
patent: 3408805 (2003-03-01), None
patent: 2004-273895 (2004-09-01), None
Disco Corporation
Heinrich Samuel M
Smith , Gambrell & Russell, LLP
LandOfFree
Wafer dividing method and laser beam processing machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer dividing method and laser beam processing machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer dividing method and laser beam processing machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4214522