Wafer dividing method and dividing apparatus

Details Wafer dividing method and dividing apparatus Wafer dividing method and dividing apparatus

2005-09-28

2008-11-04

Lebentritt, Michael (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C257SE21499, C257SE21215, C257SE21237, C438S457000, C438S459000, C438S462000, C438S478000, C438S691000

Reexamination Certificate

active

07446020

ABSTRACT:
A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising the steps of:a tape affixing step for affixing a protective tape to one side of the wafer;a wafer holding step for holding the wafer affixed to the protective tape on both sides of each dividing line through the protective tape; anda breaking step for dividing the wafer along each dividing line by sucking, along each dividing line, the wafer held through the protective tape.

REFERENCES:
patent: 7021635 (2006-04-01), Sheydayi
patent: 2003/0077879 (2003-04-01), Ohno et al.
patent: 2004/0241962 (2004-12-01), Nagai
patent: 2005/0090077 (2005-04-01), Nagai et al.
patent: 2007/0029684 (2007-02-01), Arai et al.
patent: 2007/0232030 (2007-10-01), Kumagai
patent: 2002192370 (2002-10-01), None
patent: 3408805 (2003-03-01), None
patent: 2005-129607 (2005-05-01), None

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