Wafer dividing method and apparatus

Details Wafer dividing method and apparatus Wafer dividing method and apparatus

2006-06-20

2006-06-20

Rose, Robert A. (Department: 3723)

Stone working

Splitting, shearing, and punching

C225S096500

Reexamination Certificate

active

07063083

ABSTRACT:
A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.

REFERENCES:
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patent: 4296542 (1981-10-01), Gotman
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patent: 6932259 (2005-08-01), Chen et al.
patent: 2005/0090077 (2005-04-01), Nagai et al.
patent: 3408805 (2003-03-01), None

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