Wafer dividing method

Details Wafer dividing method Wafer dividing method

2007-06-04

2010-06-15

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S460000, C438S462000, C257SE21596

Reexamination Certificate

active

07737002

ABSTRACT:
A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for die bonding on the rear surface and put on a dicing tape affixed to an annular frame along the streets, the method comprising the steps of:forming a groove along the streets in the wafer by applying a first laser beam whose elliptic focal spot has a ratio of the long axis of the short axis of 15 to 20:1 along the streets formed on the wafer; anddividing the adhesive film along the grooves by applying a second laser beam whose elliptical focal spot has a ratio of the long axis to the short axis of 60 to 70:1 to the adhesive film through the grooves formed by the wafer dividing step.

REFERENCES:
patent: 6130401 (2000-10-01), Yoo et al.
patent: 6514795 (2003-02-01), Jiang et al.
patent: 6896760 (2005-05-01), Connell et al.
patent: 7388172 (2008-06-01), Sercel et al.
patent: 2004/0180473 (2004-09-01), Kawai
patent: 2005/0242073 (2005-11-01), Nakamura et al.
patent: 2006/0035411 (2006-02-01), Oba et al.
patent: 2006/0205183 (2006-09-01), Morikazu
patent: 2006/0216911 (2006-09-01), Yoshikawa et al.
patent: 2006/0255022 (2006-11-01), Hoshino et al.
patent: 2006/0281226 (2006-12-01), Nakamura et al.
patent: 2007/0004179 (2007-01-01), Nakamura et al.
patent: 2007/0109526 (2007-05-01), Morikazu et al.
patent: 2007/0128767 (2007-06-01), Nakamura
patent: 2007/0141811 (2007-06-01), Sekiya et al.
patent: 2007/0264799 (2007-11-01), Takeda et al.
patent: 06163687 (1994-06-01), None
patent: 2000-156358 (2000-06-01), None
patent: 2003163186 (2003-06-01), None
patent: 2003173988 (2003-06-01), None
patent: 2006-051517 (2006-02-01), None
patent: 2006093368 (2006-04-01), None

Affiliated with

Also associated with

Rating

Wafer dividing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer dividing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer dividing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4232401