Wafer dividing apparatus

Details Wafer dividing apparatus Wafer dividing apparatus

2008-04-01

2008-04-01

Gartenberg, Ehud (Department: 4138)

Cutting

Means to drive or to guide tool

Bevel or miter cut

C225S103000, C225S093000, C225S097000, C438S460000, C438S462000, C438S465000, C438S463000

Reexamination Certificate

active

11254779

ABSTRACT:
A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.

REFERENCES:
patent: 4653680 (1987-03-01), Regan
patent: 5310104 (1994-05-01), Zaidel et al.
patent: 6685073 (2004-02-01), McKenna et al.
patent: 7063083 (2006-06-01), Ohmiya et al.
patent: 7179721 (2007-02-01), Nagai
patent: 7279403 (2007-10-01), Nagai et al.
patent: 2005/0090077 (2005-04-01), Nagai et al.
patent: 2005/0272225 (2005-12-01), Weber et al.
patent: 2006/0073677 (2006-04-01), Nakamura
patent: 2006/0081574 (2006-04-01), Nagai
patent: 2006/0197260 (2006-09-01), Yoshikawa et al.
patent: 2007/0045799 (2007-03-01), Sekiya
patent: 2002192370 (2002-07-01), None
patent: 3408805 (2003-03-01), None
patent: 2005-129607 (2005-05-01), None

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