Wafer die construction

Details Wafer die construction Wafer die construction

1985-09-23

1986-11-11

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

Preform severing means

Configuration of cutting implement providing shaping cavity

425385, 425394, A21C 500, A21C 1104, A21C 1108, A21C 1110

Patent

active

046219978

ABSTRACT:
An apparatus for manufacturing wafers is disclosed that includes a pair of rolls each containing cavities that form the wafers. The cavities each have outer edge walls that extend from the bottom portion of the cavity at an obtuse angle and the two rolls are arranged so that the cavities become effectively mirror images of each other as they engage at the nip. The cavities also have portions rising from the bottom thereof that impress a design substantially equal from both sides to proclude warping of the bread.

REFERENCES:
patent: 3520248 (1970-07-01), MacKendrick
patent: 4062918 (1977-12-01), Nakanose
patent: 4352831 (1982-10-01), Cavanagh et al.

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