Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2007-05-14
2009-10-06
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S460000, C438S462000, C257SE21599
Reexamination Certificate
active
07598157
ABSTRACT:
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.
REFERENCES:
patent: 4296542 (1981-10-01), Gotman
patent: 5362681 (1994-11-01), Roberts et al.
patent: 6563204 (2003-05-01), Glenn
patent: 2007/0275544 (2007-11-01), Maki et al.
Chang Kai-Sheng
Cheng Chieh
Chu Kuan-Yu
Wu Chih-Hung
Atomic Energy Countil-Institute of Nuclear Energy Research
Fourson George
Parker John M
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