Wafer dicing apparatus

Details Wafer dicing apparatus Wafer dicing apparatus

1981-03-02

1983-10-04

Whitehead, Harold D.

Stone working

Sawing

Rotary

83404, 5116572, 125 35, B28D 104

Patent

active

044072627

ABSTRACT:
Installation for the sawing of wafers of semiconductor material encompassing an alignment station (1), a sawing station (9), and a cleaning station (7). A handling device, provided to convey the wafers from one station to another, while ensuring a perfect positioning under the disc (11) of the saw, encompasses at least two supporting platforms (2, 13), of a mobile table (14) and a transfer angle-iron (15). Platforms (2) and (13) are provided to retain a wafer by suction, whether the platforms are carried by fixed support (6) or by mobile table (14).

REFERENCES:
patent: 2712306 (1955-07-01), Brescka
patent: 4016855 (1977-04-01), Mimata
patent: 4167174 (1979-09-01), Hampton

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