Wafer-dicing adhesive tape and method of producing chips...

Details Wafer-dicing adhesive tape and method of producing chips... Wafer-dicing adhesive tape and method of producing chips...

2011-07-26

2011-07-26

Speer, Timothy M (Department: 1784)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S343000

Reexamination Certificate

active

07985474

ABSTRACT:
A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.

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English machine translation of JP2003-007646 as translated on Aug. 2, 2009.
Benedek I. Pressure-Sensitive Adhesives Technology, 1997, Marcel Dekker Inc., p. 188.

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