Wafer cutting using laser marking

Details Wafer cutting using laser marking Wafer cutting using laser marking

2005-08-16

2005-08-16

Heinrich, Samuel M. (Department: 1725)

Electric heating

Metal heating

By arc

C219S121830, C700S166000

Reexamination Certificate

active

06930276

ABSTRACT:
An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.

REFERENCES:
patent: 4046985 (1977-09-01), Gates
patent: 4534804 (1985-08-01), Cade
patent: 5392181 (1995-02-01), Lhureau et al.
patent: 5972234 (1999-10-01), Weng et al.
patent: 6034349 (2000-03-01), Ota
patent: 6441504 (2002-08-01), Glenn et al.
patent: 6803247 (2004-10-01), Sekiya

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