Wafer cut method with wire saw apparatus and apparatus thereof

Details Wafer cut method with wire saw apparatus and apparatus thereof Wafer cut method with wire saw apparatus and apparatus thereof

1997-05-12

2000-05-30

Rose, Robert A.

Stone working

Sawing

Endless

125 1602, B28D 108

Patent

active

06067976&

ABSTRACT:
The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.

REFERENCES:
patent: 2866448 (1958-12-01), Dessureau et al.
patent: 3220149 (1965-11-01), Dioguardi
patent: 3400494 (1968-09-01), Seitz
patent: 4160439 (1979-07-01), Plat
patent: 4484502 (1984-11-01), Ebner
patent: 4574769 (1986-03-01), Ishikawa
patent: 4967725 (1990-11-01), Hinzen
patent: 5269285 (1993-12-01), Toyama et al.

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