Wafer cooling device

Details Wafer cooling device Wafer cooling device

1994-04-28

1995-05-09

Flanigan, Allen J.

Heat exchange

Movable heating or cooling surface

16510433, 2504431, F28F 500

Patent

active

054131677

ABSTRACT:
A wafer cooling device includes a wafer chuck; a heat exchanger having an internal structure for circulation of cooling water therethrough; and a flexible heat pipe for providing heat communication between the wafer chuck and the heat exchanger.

REFERENCES:
patent: 3604503 (1971-09-01), Feldman, Jr.
patent: 4023616 (1977-05-01), Scherbaum
patent: 4296796 (1981-10-01), Wulf
patent: 4733331 (1988-03-01), Chauvet
patent: 5066131 (1991-11-01), Iwata et al.
Fitton, "Taking Out the Heat," Electronic Engineering, vol. 45, Dec. 1973, pp. 65, 67 and 68.
Moran, et al., "Self-Regulating Evaporative/Conductive Thermal Link," IBM Technical Bulletin, vol. 21, No. 8, Jan. 1979, pp. 3281 through 3282.
Patent Abstracts of Japan, Kokai No. 63-65066, vol. 12, No. 297, Aug. 1988.
Patent Abstracts of Japan, Kokai No. 01-104349, vol. 13, No. 326, Apr. 1989.

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