Wafer container having electrically conductive kinematic...

Details Wafer container having electrically conductive kinematic... Wafer container having electrically conductive kinematic...

2000-08-17

2002-05-21

Bennett, G. Bradley (Department: 2859)

Geometrical instruments

Gauge

Collocating

C033S613000, C340S686200

Reexamination Certificate

active

06389706

ABSTRACT:

RELATED APPLICATION
This Application relates to the U.S. Application Ser. No. 09/641,153 filed Aug. 17, 2000 entitled, “Wafer Container Having Electrically Conductive Kinematic Coupling Groove To Detect The Presence Of The Wafer Container On A Support Surface, The Support Surface, and Method” and assigned to Semiconductor 300 Gmbtt & Co., Infineon Technologies AG and Motorola, Inc.
FIELD OF THE INVENTION
This invention relates to carriers for semiconductor wafers, and more particularly, relates to a container for transporting and storing wafers.
BACKGROUND OF THE INVENTION
In semiconductor industry, wafers have to be carefully carried between processing stations. Currently there is a trend to carry them in a container, such as, for example, in a Front Opening Unified Pod (FOUP).
FIG. 1
illustrates a simplified cross-section diagram of a conventional transportation system with FOUP
10
and support surface
20
. FOUP
10
comprises slots to hold a plurality of wafers, robotic lifting flange
17
and manual lifting handles
16
for moving the FOUP.
FOUP
10
temporarily rests with its base plate
19
on support surface
20
of the processing equipment, such as a load port, a container shelf within a buffer or a stocker, or elsewhere. A transportation vehicle can also have such a support surface
20
.
In order to align the position of FOUP
10
to the processing equipment with surface
20
, kinematic coupling is used. A set of kinematic coupling grooves
11
,
12
(only 2 of 3 shown) in the base plate
19
of FOUP
10
engages with kinematic coupling pins
21
,
22
in support surface
20
(only 2 of 3 shown). Grooves
11
,
12
settle over pins
21
,
22
to establish points of mechanical contact. The dimension of the grooves and of the pins are standardized so that FOUPs of various suppliers are compatible with each other (SEMI E 57 “Mechanical Specification for Kinematic Couplings used to align and support 300-mm Wafer Carriers”).
There are instances where the FOUP is not placed on the support surface as specified in the standard. Hence, there is a need to monitor the FOUP placement.


REFERENCES:
patent: 3284910 (1966-11-01), Klasek
patent: 5138772 (1992-08-01), Barnes
patent: 5456018 (1995-10-01), Irlbeck et al.
patent: 6008727 (1999-12-01), Want et al.
patent: 6010008 (2000-01-01), Nyseth et al.
patent: 6010009 (2000-01-01), Peterson et al.
patent: 6085967 (2000-07-01), Grande et al.
patent: 6151792 (2000-11-01), Ohlig et al.
patent: WO99/50577 (1999-10-01), None

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