Wafer collecting apparatus

Details Wafer collecting apparatus Wafer collecting apparatus

1998-11-17

2000-10-24

Banks, Derris H.

Stone working

Sawing

Endless

125 1602, 125 20, B28D 108

Patent

active

061351024

ABSTRACT:
A running bonded abrasive wire cuts wafers one by one from a slice base, which hold the wafers. The cut wafers are transported on the first conveyor to a collecting part. During the transport process, a CCD camera images the shape of the wafer, and outputs the image data of the wafer to a control unit. The control unit image-processes the image data to recognize whether the transported wafers are normal or inferior. In accordance with the recognition results, the collecting part collects the normal wafers and the inferior wafers separately.

REFERENCES:
patent: 4891530 (1990-01-01), Hatji
patent: 5605141 (1997-02-01), Bilotta
patent: 5715807 (1998-02-01), Toyama et al.
patent: 5771876 (1998-06-01), Egglhuber
patent: 5848868 (1998-12-01), Suzuki et al.

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