Wafer cleaning system

Cleaning and liquid contact with solids – Processes – Using solid work treating agents

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Details

15 77, 15102, B08B 700, A47L 102

Patent

active

060598883

ABSTRACT:
A wafer scrubbing system includes a upper and lower elongated scrubbers extending generally parallel with one another, the scrubbers being driven in rotation about their own axes. The wafer is disposed between the scrubbers so that the top and bottom surfaces of the wafer engage the scrubbers. The scrubbers are arranged to provide different frictional forces with the wafer at opposite ends of the scrubbers, and thereby provide a torque on the wafer about a central axis transverse to the top and bottom surfaces of the wafer and transverse to the scrubber axes.

REFERENCES:
patent: 3261286 (1966-07-01), Hunter et al.
patent: 5675856 (1997-10-01), Itzkowitz
patent: 5860181 (1999-01-01), Maekawa et al.
patent: 5862560 (1999-01-01), Jensen et al.
patent: 5868857 (1999-02-01), Moinpour et al.
patent: 5966765 (1999-10-01), Hamada et al.
patent: 5976267 (1999-11-01), Culkins et al.

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