Wafer cleaning method and apparatus therefor

Details Wafer cleaning method and apparatus therefor Wafer cleaning method and apparatus therefor

1990-05-04

1992-10-27

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With heating, cooling or heat exchange means

134108, 134902, B08B 310

Patent

active

051581000

ABSTRACT:
A wafer cleaning method and apparatus in which a cleaning solution is caused to evaporate at a temperature below its boiling point, and cleaning vapor thus produced is applied at a temperature above its dew point to a wafer such as a semiconductor wafer. The wafer is cleaned without formation of colloidal silica in the absence of aerosol, or etched uniformly free of impurities. The wafer cleaning apparatus comprises a cleaning solution storage, a vapor generating section, a wafer supporting position of a wafer supporting device and a vapor supply section. These components are arranged in a housing to overlap one another in plan view and to lie vertically close to one another. The apparatus has a compact overall construction with simplified seals for preventing leakage of the cleaning vapor.

REFERENCES:
patent: 2366949 (1945-01-01), Woppman et al.
patent: 3113046 (1963-12-01), Reddick et al.
patent: 3308839 (1967-03-01), Barday
patent: 3406697 (1968-10-01), Mitchell et al.
patent: 4156621 (1979-05-01), Andrews et al.
patent: 4315042 (1982-02-01), Spigarelli
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4838476 (1989-06-01), Rahn

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