Wafer cleaning method

Details Wafer cleaning method Wafer cleaning method

1989-07-07

1991-04-23

Pal, Asok

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

134198, 51320, 51321, 51322, 51439, B08B 700, F25D 1702

Patent

active

050092405

ABSTRACT:
A wafer cleaning system which cleans semiconductor wafers by sand blasting them with ice particles is disclosed. In this system a stream of gas is conducted by a conduit to the semiconductor wafer while a spray of water is frozen into the ice particles by a number of cooling coil systems which protrude into the conduit. After the semiconductor wafer is sandblasted with ice, any residual ice is removed simply by evaporating it. This results in a clean wafer without the contamination that can accompany chemical solvents of other semiconductor cleaning and etching systems.

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patent: 4655847 (1987-04-01), Ichinoseki et al.
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