Wafer cleaning apparatus

Details Wafer cleaning apparatus Wafer cleaning apparatus

1996-01-05

1999-02-23

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

134902, 134153, B08B 302

Patent

active

058733809

ABSTRACT:
A cleaning apparatus is provided which removes contaminants sticking onto a wafer without damaging a device. The cleaning apparatus includes liquid supply means 23 for supplying a liquid not reactive to material constituting a wafer 1, and droplet forming means 10 for interrupting the liquid supplied from liquid supply means 23 to form a droplet 21 out of the liquid. The cleaning apparatus further includes spurting means 22 for spurting the droplet 21 toward the surface of wafer 1.

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