Wafer clamping device for a double side grinder

Details Wafer clamping device for a double side grinder Wafer clamping device for a double side grinder

2005-01-20

2011-11-29

Morgan, Eileen P. (Department: 3723)

Abrading

Work holder

C451S365000, C451S261000, C451S262000, C451S267000, C451S282000

Reexamination Certificate

active

08066553

ABSTRACT:
A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

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International Search Report for WO 2005/095054, 3 Pages.
Search report for analogous Taiwanese Application No. 094103075 issued May 27, 2007 (the search report was received by applicant, however, on Sep. 7, 2007.).
Written Report mailed Feb. 18, 2011 regarding EP05711676.6; 4 pages.

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