Wafer chucking apparatus for spin processor

Details Wafer chucking apparatus for spin processor Wafer chucking apparatus for spin processor

2007-04-10

2007-04-10

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

C134S092000, C134S137000, C134S157000, C134S140000, C134S164000, C156S345510, C156S345540, C156S345550

Reexamination Certificate

active

11403137

ABSTRACT:
A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.

REFERENCES:
patent: 5820685 (1998-10-01), Kurihara et al.
patent: 7056392 (2006-06-01), Kuroki et al.
patent: 2 242 065 (1987-10-01), None
patent: 9107023 (1997-04-01), None

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