Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment
Reexamination Certificate
2006-06-06
2006-06-06
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
With work or work parts movable during treatment
C134S032000, C134S137000, C134S142000, C134S157000, C134S092000, C134S140000, C134S164000, C034S312000, C034S328000, C156S345510, C156S345550
Reexamination Certificate
active
07056392
ABSTRACT:
A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
REFERENCES:
patent: 5974680 (1999-11-01), Anderson et al.
patent: 6752162 (2004-06-01), Gardner et al.
patent: 2004/0195785 (2004-10-01), Jan
patent: 0242996 (1987-10-01), None
patent: 09-107023 (1997-04-01), None
Kuroki Kyoko
Seto Hideaki
Beyer Weaver & Thomas LLP
Kornakov M.
LSI Logic Corporation
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