Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-11-22
2005-11-22
Goudreau, George A. (Department: 1763)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S745000, C438S754000, C216S092000, C216S105000, C134S001300
Reexamination Certificate
active
06967174
ABSTRACT:
A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for example, attached to arms of the wafer chuck. These members may assume an alignment position when a robot arm places the wafer on the chuck. In this position, they guide the wafer into a proper alignment position with respect to the chuck. During rotation at a particular rotational speed, the alignment members move away from the wafer to allow liquid etchant to flow over the entire edge region of the wafer. At still higher rotational speeds, the wafer is clamped into position to prevent it from flying off the chuck. A clamping cam or other device (such as the alignment member itself) may provide the clamping.
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Feng Jingbin
Mayer Steven T.
McCutcheon Andy
Schall Jim
Taatjes Steve
Beyer Weaver & Thomas LLP
Goudreau George A.
Novellus Systems Inc.
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