Wafer chuck comprising a curved reference surface

Details Wafer chuck comprising a curved reference surface Wafer chuck comprising a curved reference surface

1986-04-28

1988-02-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29559, 295691, 269 21, 279 3, 2504922, 51235, B24B 4700, B25B 1100, B23B 534, H01L 2168

Patent

active

047242221

ABSTRACT:
A chuck for holding a workpiece (e.g., a semiconductor wafer) in a vacuum comprises a curved reference surface. By clamping the edges of the workpiece and maintaining its backside against the curved surface (or against pins mounted on the surface), the frontside of the workpiece can be thereby established in a precise equidistant relationship with respect to the reference surface. Such a chuck is advantageous for holding wafers to be lithographically patterned in a high-resolution way by electron-beam, ion-beam and X-ray-beam techniques.

REFERENCES:
patent: 3920233 (1975-11-01), Stuckert
patent: 4213698 (1980-07-01), Firtion et al.
patent: 4310743 (1982-01-01), Seliger
patent: 4443704 (1984-04-01), Yamashita et al.
patent: 4475223 (1984-10-01), Taniguchi et al.
patent: 4517465 (1985-05-01), Gault et al.
patent: 4603466 (1986-08-01), Marley

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