Wafer characteristics via reflectometry

Details Wafer characteristics via reflectometry Wafer characteristics via reflectometry

2003-03-14

2010-10-19

Siefke, Sam P (Department: 1797)

Chemical apparatus and process disinfecting, deodorizing, preser

Analyzer, structured indicator, or manipulative laboratory...

Means for analyzing liquid or solid sample

C422S050000, C422S068100, C422S082090, C436S005000

Reexamination Certificate

active

07815862

ABSTRACT:
Various exemplary methods (800, 900, 1000, 1100) are directed to determining wafer thickness and/or wafer surface characteristics. An exemplary method (900) includes measuring reflectance of a wafer and comparing the measured reflectance to a calculated reflectance or a reflectance stored in a database. Another exemplary method (800) includes positioning a wafer on a reflecting support to extend a reflectance range. An exemplary device (200) has an input (210), analysis modules (222-228) and optionally a database (230). Various exemplary reflectometer chambers (1300, 1400) include radiation sources positioned at a first altitudinal angle (1308, 1408) and at a second altitudinal angle (1312, 1412). An exemplary method includes selecting radiation sources positioned at various altitudinal angles. An exemplary element (1650, 1850) includes a first aperture (1654, 1854) and a second aperture (1658, 1858) that can transmit reflected radiation to a fiber and an imager, respectfully.

REFERENCES:
patent: 3994586 (1976-11-01), Sharkins et al.
patent: 4453828 (1984-06-01), Hershel et al.
patent: 4625114 (1986-11-01), Bosacchi et al.
patent: 4821282 (1989-04-01), Podgorski
patent: 4850711 (1989-07-01), Sano et al.
patent: 5289266 (1994-02-01), Shih et al.
patent: 5386119 (1995-01-01), Ledger
patent: 5396332 (1995-03-01), Ciszek
patent: 5420803 (1995-05-01), Judell
patent: 5436725 (1995-07-01), Ledger
patent: 5486701 (1996-01-01), Norton et al.
patent: 5517312 (1996-05-01), Finarov
patent: 5650635 (1997-07-01), Razeghi et al.
patent: 5695556 (1997-12-01), Tamamura et al.
patent: 5724144 (1998-03-01), Muller et al.
patent: 5724145 (1998-03-01), Kondo et al.
patent: 5747201 (1998-05-01), Nakayama et al.
patent: 5849108 (1998-12-01), Kariya et al.
patent: 5963781 (1999-10-01), Winer
patent: 6024794 (2000-02-01), Tamamura et al.
patent: 6107116 (2000-08-01), Kariya et al.
patent: 6132289 (2000-10-01), Labunsky et al.
patent: 6175123 (2001-01-01), Kano
patent: 6197606 (2001-03-01), Polignano et al.
patent: 6275295 (2001-08-01), Sopori
patent: 6366861 (2002-04-01), Waldhauer et al.
patent: 6437868 (2002-08-01), Coult et al.

Affiliated with

Also associated with

Rating

Wafer characteristics via reflectometry does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer characteristics via reflectometry, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer characteristics via reflectometry will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4203596