Wafer chamfering method and apparatus

Details Wafer chamfering method and apparatus Wafer chamfering method and apparatus

1998-03-09

2000-05-23

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 65, 451178, 451254, B24B 100

Patent

active

060660317

ABSTRACT:
A wafer to be chamfered is supported in such a manner as to rotate and to move in the X-axis direction and the Y-axis direction which are perpendicular to one another, and a periphery grinding wheel is rotatably placed on the Y-axis. To chamfer a circular part of the wafer, the circular part of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is rotated. To chamfer an orientation flat of the wafer, the orientation flat of the wafer is pressed against the rotating periphery grinding wheel, and then, the wafer is fed in the X-axis direction.

REFERENCES:
patent: 5036624 (1991-08-01), Steere, Jr.
patent: 5097630 (1992-03-01), Maeda et al.
patent: 5295331 (1994-03-01), Honda et al.
patent: 5445554 (1995-08-01), Hosokawa
patent: 5538463 (1996-07-01), Hasegawa et al.
patent: 5609514 (1997-03-01), Yssunaga et al.
patent: 5658189 (1997-08-01), Kagamida

Affiliated with

Also associated with

Rating

Wafer chamfering method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer chamfering method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer chamfering method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1833532