Abrading – Machine – Combined
Patent
1994-11-08
1997-03-11
Rose, Robert A.
Abrading
Machine
Combined
451 44, B24B 906
Patent
active
056095147
ABSTRACT:
There is provided a wafer chamfering machine, wherein chamfering of a notch of a wafer can be accurately performed the space of the wafer chamfering machine is compact size, the costs are reduced and the time required for chamfering is shorten. In a wafer chamfering machine, wherein a rotatable wafer table and a rotatable grindstone for working on the outer periphery are made relatively vertically and horizontally movable the wafer is held on the wafer table, relative vertical positions between the wafer table and the grindstone for working on the outer periphery are set, and the wafer table and the grindstone for working on the outer periphery are made to relatively approach each other with the wafer table and the grindstone for working on the outer periphery being rotated, to thereby chamfer the outer periphery of the wafer, a notch chamfering work unit is provided on the side of the wafer table of a grindstone shaft receiving rack of the grindstone for working on the outer periphery at a position not interfering with the grindstone for working on the outer periphery, whereby, after chamfering the outer periphery of the wafer, chamfering of the notch is performed on the same wafer table.
REFERENCES:
patent: 5289661 (1994-03-01), Jones et al.
patent: 5295331 (1994-03-01), Honda et al.
patent: 5317836 (1994-06-01), Hasegawa et al.
patent: 5445554 (1995-08-01), Hosokawa
Kagamida Takeshi
Yasunaga Masaaki
Rose Robert A.
Tokyo Seimitsu Co. Ltd.
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