Wafer chamfer polishing apparatus with rotary circular dividing

Abrading – Machine – Rotary tool

Patent

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Details

451401, 451 44, 451388, B24B 906, B25B 500

Patent

active

054046785

ABSTRACT:
A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.

REFERENCES:
patent: 2507998 (1950-05-01), Russell
patent: 5062384 (1991-11-01), Foley et al.
patent: 5094037 (1992-03-01), Hakomori et al.
patent: 5273615 (1993-12-01), Assetta et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5335457 (1994-08-01), Matsuda et al.

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