Measuring and testing – Instrument proving or calibrating – Displacement – motion – distance – or position
Patent
1998-06-02
2000-03-07
Raevis, Robert
Measuring and testing
Instrument proving or calibrating
Displacement, motion, distance, or position
B65G 6500
Patent
active
060325127
ABSTRACT:
A wafer centering device which includes a wafer centering chuck and a wafer calibration disk and a method for using such device are disclosed. The wafer centering chuck can be advantageously used to replace a vacuum chuck in a processing station that utilizes a rotating wafer platform. A center locating pin provided at the center of the wafer centering chuck can then be used to calibrate a centering position for a liquid dispensing nozzle head which dispenses any type of liquid on a rotating wafer. The wafer calibration disk may be used advantageously to calibrate the motion of a robot arm wafer loader when the disk is used in place of a regular wafer. A center aperture and a calibration grid provided on the wafer calibration disk may be used advantageously to identify the deviation of the center when the calibration disk is placed on a wafer centering chuck by the robotic arm. An edge bead portion provided on a top surface of the wafer calibration disk may further be used to provide calibration for a spray nozzle head used in an edge bead rinsing process. The present invention novel wafer centering chuck and wafer calibration disk can therefore be used either individually, or in combination thereof, for the calibration of a wafer processing machine that utilizes a rotating wafer platform such that a wafer may be positioned on a properly centered vacuum chuck. The present invention novel apparatus and method can be used advantageously to replace conventional apparatus and methods which are both time and labor consuming.
REFERENCES:
patent: 4909695 (1990-03-01), Hurwitt et al.
patent: 5851102 (1998-12-01), Okawa et al.
patent: 5877404 (1999-03-01), Fahley
Raevis Robert
Taiwan Semiconductor Manufacturing Co. Ltd.
LandOfFree
Wafer centering device and method of using does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer centering device and method of using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer centering device and method of using will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-352692