Wafer centering assembly

Details Wafer centering assembly Wafer centering assembly

1990-01-10

1991-10-22

Rachuba, M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51216LP, 51237R, B24B 4702

Patent

active

050583280

ABSTRACT:
The wafer centering assembly includes a pair of pivot arms which can be pivoted simultaneously to adjust to the diameter of a conveyed wafer. Each pivot arm has a stop which arrest the motion of a wafer such that the axis of the wafer is approximately centered on the axis of a vacuum head.

REFERENCES:
patent: 774563 (1904-11-01), Clark
patent: 2019789 (1935-11-01), Mahannah
patent: 2418463 (1947-04-01), Coleman
patent: 2887918 (1959-05-01), Benson
patent: 4524959 (1985-06-01), Kubo
patent: 4638601 (1987-01-01), Steere et al.
patent: 4721198 (1988-01-01), Yajima et al.

Affiliated with

Also associated with

Rating

Wafer centering assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer centering assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer centering assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-100653