Wafer carrier with pressurized membrane and retaining ring...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S288000, C451S041000

Reexamination Certificate

active

11594267

ABSTRACT:
A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface of the wafer carrier such that pressure in the bladder is independently regulated to control the downward force acting on the wafer during CMP. In addition, an edge control bladder may also be disposed within the carrier such that if the pressure in the bladder is also regulated, the amount of force on the edge of the wafer changes. By regulating retaining ring actuator pressure, inflatable membrane pressure, and edge control bladder pressure, non-uniformities in the wafer surface and edge effect may be addressed during CMP.

REFERENCES:
patent: 4821997 (1989-04-01), Zdeblick
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 6019670 (2000-02-01), Cheng et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6080050 (2000-06-01), Chen et al.
patent: 6110025 (2000-08-01), Williams et al.
patent: 6113480 (2000-09-01), Hu et al.
patent: 6143123 (2000-11-01), Robinson et al.
patent: 6196905 (2001-03-01), Inaba
patent: 6215642 (2001-04-01), Sogard
patent: 6277009 (2001-08-01), Chen et al.
patent: 6325696 (2001-12-01), Boggs et al.
patent: 6368189 (2002-04-01), Maloney et al.
patent: 6386957 (2002-05-01), Masumura et al.
patent: 6458015 (2002-10-01), Robinson et al.
patent: 6506105 (2003-01-01), Kajiwara et al.
patent: 6579151 (2003-06-01), Tseng et al.
patent: 6716094 (2004-04-01), Shendon et al.
patent: 6726537 (2004-04-01), Crevasse et al.
patent: 6746318 (2004-06-01), Mallery et al.
patent: 6869348 (2005-03-01), Spiegel
patent: 6890249 (2005-05-01), Zuniga et al.
patent: 6976908 (2005-12-01), Masunaga et al.
patent: 2003/0053283 (2003-03-01), Loo et al.
patent: 2003/0151153 (2003-08-01), Jarvinen et al.
patent: 2003/0181151 (2003-09-01), Chao et al.
patent: 2003/0211811 (2003-11-01), Berman et al.
patent: 2004/0102138 (2004-05-01), Saldana
patent: 2004/0235399 (2004-11-01), Owczarz et al.

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