Wafer carrier structure for chemical-mechanical polisher

Details Wafer carrier structure for chemical-mechanical polisher Wafer carrier structure for chemical-mechanical polisher

2001-05-21

2004-01-27

Wilson, Lee D. (Department: 3723)

Abrading

Machine

Rotary tool

C451S041000, C451S060000, C451S285000, C451S287000, C451S288000, C451S289000, C451S446000

Reexamination Certificate

active

06682409

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a chemical-mechanical polishing device. More particularly, the present invention relates to a wafer carrier structure for a chemical-mechanical polishing device.
2. Description of Related Art
Chemical-mechanical polishing is one of the principal techniques for global planarization. Chemical-mechanical polishing is a physical process of grinding using a polishing wheel with the assistance of a suitable chemical reagent so that all uneven profiles on a silicon wafer are universally flattened.
FIG. 1
is a schematic side view of a conventional chemical-mechanical polishing device.
FIG. 2
is a schematic top view of the conventional chemical-mechanical polishing device shown in FIG.
1
. As shown in
FIGS. 1 and 2
, the chemical-mechanical polishing device includes a polishing table
100
, a wafer carrier
106
(alternatively called a polishing head), a polishing pad
102
and a slurry-supply pipe
110
. The wafer carrier
106
is used to hold a wafer
104
and comprises a holder
105
, a hole (not shown) to apply suction to the wafer
104
and a retaining ring to support the wafer
104
. The polishing pad
102
is placed on the polishing table
100
and the slurry-supply pipe
110
are used to deliver slurry
110
a
to the polishing pad
102
. To carry out a chemical-mechanical polishing, the polishing table
100
and the wafer carrier
106
rotate according to a set of preset directions. The wafer carrier
106
grasps the backside
104
a
of the wafer
104
and presses the front face
104
b
of the wafer
104
against the polishing pad
102
. The slurry-supply pipe
110
continuously delivers slurry
110
a
to the polishing pad
102
. Any protruding sections on the wafer react with the chemical reagents in the slurry
110
a
. The protruding sections are also bombarded by abrasive particles in the slurry
110
a
and scraped by the roughened surface of the polishing pad
102
. Such chemical reaction and physical abrasion continues for some time until the entire wafer surface is planarized.
In a conventional chemical-mechanical polishing system, the wafer carrier and the slurry supply pipeline are separate components on the polishing table so that considerable space above the chemical-mechanical polishing table is occupied. Furthermore, distribution of slurry over the polishing pad by a conventional slurry supply pipeline is usually non-uniform.
SUMMARY OF THE INVENTION
Accordingly, one object of the present invention is to provide an integrated wafer carrier structure above the polishing table of a chemical-mechanical polishing device. The carrier structure incorporates a slurry supply pipeline so that the space above the polishing table is less cluttered.
A second object of this invention is to provide an integrated wafer carrier structure for a chemical-mechanical polishing device. The carrier structure incorporates a slurry supply pipeline so that fabrication and maintenance costs are reduced. A third object of this invention is to provide an integrated carrier wafer structure for a chemical-mechanical polishing device. The slurry supply pipeline incorporated with the carrier wafer structure is able to improve the distribution of slurry over the polishing pad of the polishing device.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a wafer carrier structure for a chemical-mechanical polishing device. The wafer carrier structure includes a holder and a slurry supply pipeline. The slurry supply pipeline is mounted on the side of the holder with the outlet of the pipeline pointing in a direction parallel to the sidewall of the holder.
This invention also provides an alternative carrier structure for a chemical-mechanical polishing device. The wafer carrier structure includes a holder and a slurry supply pipeline. The slurry supply pipeline is mounted on the side of the holder with the outlet of the pipeline pointing in a direction perpendicular to the sidewall of the holder.
In this invention, the wafer carrier and the slurry supply pipeline are integrated together. Hence, more space is available above the polishing table of the chemical-mechanical polisher. Furthermore, both fabrication cost and maintenance cost of the polisher are reduced and uniformity of slurry distribution over the polishing pad is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.


REFERENCES:
patent: 5782675 (1998-07-01), Southwick
patent: 6347979 (2002-02-01), Drill
patent: 6387289 (2002-05-01), Wright
patent: 6406361 (2002-06-01), Zuniga et al.
patent: 6425810 (2002-07-01), Komuro

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