Wafer carrier rotating head assembly for chemical-mechanical pol

Details Wafer carrier rotating head assembly for chemical-mechanical pol Wafer carrier rotating head assembly for chemical-mechanical pol

1997-04-14

1999-02-09

Morgan, Eileen P.

Abrading

Machine

Rotary tool

451288, 451397, 451398, B24B 700

Patent

active

058686096

ABSTRACT:
A chemical-mechanical polishing apparatus includes a wafer carrier with a very low center of gravity which allows pressure to be applied evenly on a wafer being polished. The wafer carrier includes top, center, and bottom mating subassemblies with only the center and bottom subassembly or wafer holder actually rotating. The bottom of the central subassembly and the top of the bottom subassemblies are shaped as negative and positive, mating truncated pyramids with a downward extension at the center axis of the central subassembly which terminates in a ball in a recess in the top of the lower subassembly. The ball is positioned as low as possible to provide a very low center of gravity to ensure even pressure distribution over a wafer being polished. The truncated pyramidal shapes are to provide a geometry which exhibits a rigid structure with incrementally decreasing mass with distance from the central axis.

REFERENCES:
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5624299 (1997-04-01), Shendon
patent: 5626509 (1997-05-01), Hayashi
patent: 5651724 (1997-07-01), Kimura et al.

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