Wafer carrier rinsing mechanism

Details Wafer carrier rinsing mechanism Wafer carrier rinsing mechanism

1999-07-20

2001-09-11

Rose, Robert A. (Department: 3723)

Abrading

Machine

Combined

C451S054000, C239S556000

Reexamination Certificate

active

06287178

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates generally to multi-step chemical mechanical polishing processes and, more particularly, to a wafer carrier rinsing mechanism.
2. Related Art
Chemical-mechanical polishing (hereinafter “CMP”), is a common method of planarization used in semiconductor manufacture. CMP typically involves the use of a circular polishing pad, mounted to a polishing table or platen, which is held in contact with the surface of the semiconductor wafer via a carrier. An abrasive slurry, typically water-based, is applied to the surface of the polishing pad to facilitate and enhance polishing of the wafer. During a polishing process, both the polishing pad and wafer are rotated relative to one another. As a result, unwanted material is removed from the surface of the wafer, producing a planarized surface. Once complete, the wafer can be transported to a subsequent processing step, e.g., a secondary polishing operation, or a cleaning process.
However, after a polishing operation, residual foreign materials tend to remain on the surface of the polished wafer, which in turn can lead to cross contamination with subsequent processing steps. Because each subsequent processing step can be adversely affected by residual foreign materials from a previous step, failure to adequately reduce such contamination can lead to higher costs. Furthermore, eliminating the cross contamination is becoming more and more vital as the level of precision required for higher integrated circuit (IC) device densities increases. Accordingly, a need exists for improved tools for eliminating cross contamination in CMP processing.
SUMMARY OF THE INVENTION
The present invention provides an apparatus for removing foreign materials from a semiconductor wafer and wafer carrier that holds the wafer in place. The apparatus comprises a washer assembly having a plurality of prepositioned nozzles for ejecting a fluid against a surface of the wafer while the carrier is rotating in order to cleanse either/both the wafer surface and the wafer carrier. The washer assembly may include a first plurality of nozzles positioned for spraying a leading edge of the wafer surface, a second plurality of nozzles positioned for spraying a trailing edge of the wafer surface, and a third plurality of nozzles positioned outwardly (i.e., away from the center of the wafer) for forcing foreign materials towards an edge of the wafer surface. The washer assembly may also, for example, include nozzles that are positioned to both spray a leading edge of the wafer and force foreign materials towards an edge of the wafer, or alternatively, positioned to spray a trailing edge and force foreign materials towards an edge of the wafer. In addition, each nozzles can be altered to control the spray pattern associated with the nozzle.


REFERENCES:
patent: 4519846 (1985-05-01), Aigo
patent: 5349978 (1994-09-01), Sago et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5779816 (1998-07-01), Trinh
patent: 5804507 (1998-09-01), Perlov et al.

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