Wafer carrier ring method and apparatus for chemical-mechanical

Details Wafer carrier ring method and apparatus for chemical-mechanical Wafer carrier ring method and apparatus for chemical-mechanical

1996-12-30

1999-09-07

Housel, James C.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

451 1, 451 28, 451 64, 451177, 216 83, 216 89, 438689, 438690, 438691, 438692, C23F 102, B24B 4900, B24B 100, B24B 700

Patent

active

059482044

ABSTRACT:
The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring. The stainless steel material of the second ring improves the sealing to the rubber bladder and reduces the bending of the first ring during the polishing process. The results include reduced leakage from the sealing and reducing particle counts.

REFERENCES:
patent: 5624299 (1997-04-01), Shendon
patent: 5635083 (1997-06-01), Breivogel et al.

Affiliated with

Also associated with

Rating

Wafer carrier ring method and apparatus for chemical-mechanical does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer carrier ring method and apparatus for chemical-mechanical , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer carrier ring method and apparatus for chemical-mechanical will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1800947