Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2007-01-02
2007-01-02
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
Reexamination Certificate
active
10425896
ABSTRACT:
A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.
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Kalenian William J.
Walsh Thomas A.
Arancibia Maureen G.
Crockett & Crockett
Crockett, Esq. K. David
Hassanzadeh Parviz
Strasbaugh
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