Wafer carrier having carrier ring adapted for uniform chemical-m

Abrading – Machine – Rotary tool

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Details

451287, 451288, 451289, 451 41, 451391, 451378, 451370, B24B 500

Patent

active

056790651

ABSTRACT:
The present invention is a carrier ring for a semiconductor wafer carrier in which an exposed surface of the carrier ring facing a polishing pad either slopes, is stepped, or is curved away from the polishing pad from the inner periphery to the outer periphery of the carrier ring. As a result, the exposed surface of the carrier ring is spaced farther from the polishing pad adjacent its outer periphery than it is adjacent its inner periphery, thereby increasing the volume and uniformity of slurry transported beneath the wafer.

REFERENCES:
patent: 4519168 (1985-05-01), Cesna
patent: 5204082 (1993-04-01), Shendon et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh

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