Wafer carrier for semiconductor wafer polishing machine

Details Wafer carrier for semiconductor wafer polishing machine Wafer carrier for semiconductor wafer polishing machine

1997-07-25

1999-06-29

Rose, Robert A.

Abrading

Machine

Rotary tool

451398, 451388, B24B 722

Patent

active

059160152

ABSTRACT:
A carrier assembly for use in the processing of semiconductor wafers which avoids the use of a gimbal mechanism. The wafer carrier assembly comprises a backing pad for the wafer, with the wafer and backing pad secured within a retaining ring, such that the retaining ring, wafer, and backing pad move as single, integral assembly. A resiliently flexible outer housing terminates in a pad load ring transmits the rotation of the drive shaft to the load plate while allowing limited axial movement between the outer ring and inner ring assembly. The wafer/load plate assembly is permitted to float within the outer ring while the outer ring locally depresses the polishing pad near the wafer periphery, to mitigate edge exclusion.

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