Wafer carrier for film planarization

Details Wafer carrier for film planarization Wafer carrier for film planarization

1994-01-05

1995-09-12

Rose, Robert A.

Abrading

Machine

Rotary tool

451388, 451287, B24B 722

Patent

active

054493161

ABSTRACT:
The apparatus is used to remove material uniformly from all regions of a wafer surface that is being polished. This is in contrast to conventional lapping machines which preferentially remove material from the high spots on the surface being polished so as to render the surface planar. The result of the present invention is achieved by providing a downwardly-opening plenum on the underside of a carrier. The opening is covered by a flexible membrane, and when a pressurized fluid is applied to the plenum, the membrane applies a uniform downward pressure across the entire upper surface of a wafer that is being polished. The uniform pressure results in a uniform removal of material all across the wafer. The wafer is typically 680 microns thick and the coating is typically two microns thick. Through use of the apparatus, the thickness of the coating is uniformly reduced to about 0.8 micron while maintaining the uniformity of the coating to within 0.02 micron.

REFERENCES:
patent: 4897966 (1990-02-01), Takahashi
patent: 4918869 (1990-04-01), Kitta
patent: 5081795 (1992-01-01), Tanaka et al.

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