Wafer carrier for chemical mechanical polishing

Abrading – Machine – Rotary tool

Patent

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Details

451 63, 451 41, 451288, 451285, 451287, 156345, B24B 700

Patent

active

060074116

ABSTRACT:
A wafer carrier for chemical mechanical polishing. The carrier has a notch where wafers are placed for polishing and a ledge around the notch. An outer rim extends from the ledge and, during polishing, below the polished wafer compressing a polishing pad therebelow. Slurry is provided to the polishing pad, during polishing, by slurry channels through the carrier into the ledge. Excess slurry exits through the pad or, optionally, through a plurality of exit channels through the rim.

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patent: 5394655 (1995-03-01), Allen et al.
patent: 5474644 (1995-12-01), Kato et al.
patent: 5486265 (1996-01-01), Salugsugan
patent: 5597346 (1997-01-01), Hempel, Jr.

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