Abrading – Machine – Rotary tool
Reexamination Certificate
2006-03-07
2006-03-07
Nguyen, Dung Van (Department: 3723)
Abrading
Machine
Rotary tool
C451S398000, C451S400000
Reexamination Certificate
active
07008308
ABSTRACT:
A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.
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Bjelopavlic Mick
Grabbe Alexis
Haler Michele
Ragan Tracy M.
MEMC Electronic Materials , Inc.
Nguyen Dung Van
Powers Senniger
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