Wafer bonding process employing liquid oxidant

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148DIG135, 437 62, 437 86, B32B 3124

Patent

active

052661350

ABSTRACT:
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.

REFERENCES:
patent: 2974075 (1961-03-01), Miller
patent: 3239908 (1966-03-01), Nakamura
patent: 3689357 (1972-09-01), Jordan
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4738935 (1988-04-01), Shimbo et al.
patent: 4854986 (1989-08-01), Raby
patent: 4883215 (1989-11-01), Geosele et al.
patent: 4962062 (1990-10-01), Uchiyama et al.
patent: 5131968 (1992-07-01), Wells et al.
"Silicon-to-silicon direct bonding method" Shimbo et al, J. Appl. Phys. 60, Oct. 15, 1986, pp. 2987-2988.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer bonding process employing liquid oxidant does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer bonding process employing liquid oxidant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonding process employing liquid oxidant will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2092569

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.