Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-02-12
1993-11-30
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
148DIG135, 437 62, 437 86, B32B 3124
Patent
active
052661350
ABSTRACT:
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.
REFERENCES:
patent: 2974075 (1961-03-01), Miller
patent: 3239908 (1966-03-01), Nakamura
patent: 3689357 (1972-09-01), Jordan
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4738935 (1988-04-01), Shimbo et al.
patent: 4854986 (1989-08-01), Raby
patent: 4883215 (1989-11-01), Geosele et al.
patent: 4962062 (1990-10-01), Uchiyama et al.
patent: 5131968 (1992-07-01), Wells et al.
"Silicon-to-silicon direct bonding method" Shimbo et al, J. Appl. Phys. 60, Oct. 15, 1986, pp. 2987-2988.
McLachlan Craig J.
Rouse George V.
Short John P.
Zibrida James R.
Harris Corporation
Romano Ferdinand M.
Weston Caleb
LandOfFree
Wafer bonding process employing liquid oxidant does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer bonding process employing liquid oxidant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonding process employing liquid oxidant will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2092569