Wafer bonding method of system in package

Details Wafer bonding method of system in package Wafer bonding method of system in package

2007-09-28

2009-06-30

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S108000, C438S109000, C438S118000, C438S459000, C257SE21584, C257SE21585

Reexamination Certificate

active

07553743

ABSTRACT:
A method of bonding a wafer in a system in package is provided. A plating layer is formed on each of a first semiconductor substrate and a second semiconductor substrate. The plating layers are then bonded to each other to connect the semiconductor substrates.

REFERENCES:
patent: 4528072 (1985-07-01), Kurosawa et al.
patent: 6294467 (2001-09-01), Yokoyama et al.
patent: 2003/0092224 (2003-05-01), Hwang et al.

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