Wafer bonding method

Details Wafer bonding method Wafer bonding method

2008-12-29

2009-12-15

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21122

Reexamination Certificate

active

07632738

ABSTRACT:
A method includes steps of providing first and second substrates, and forming a bonding interface between them using a conductive bonding region. A portion of the second substrate is removed to form a mesa structure. A vertically oriented semiconductor device is formed with the mesa structure. A portion of the conductive bonding region is removed to form a contact. The vertically oriented semiconductor device is carried by the contact.

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