Electrical connectors – Contact comprising cutter – Insulation cutter
Reexamination Certificate
2005-03-29
2008-12-30
Le, Thao P. (Department: 2818)
Electrical connectors
Contact comprising cutter
Insulation cutter
Reexamination Certificate
active
07470142
ABSTRACT:
A method of coupling substrates together includes steps of providing first and second substrates. The second substrate includes a conductive bonding region positioned on its surface. Heat is provided to the conductive bonding region to reduce its number of defects. The surface of the conductive bonding region is bonded to the first substrate so that the conductive bonding region and the first substrate are coupled together.
REFERENCES:
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4732312 (1988-03-01), Kennedy et al.
patent: 4854986 (1989-08-01), Raby
patent: 5617991 (1997-04-01), Pramanick et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6600173 (2003-07-01), Tiwari
patent: 6630713 (2003-10-01), Geusic
patent: 6933205 (2005-08-01), Matsuo et al.
patent: 7109092 (2006-09-01), Tong
patent: 7148119 (2006-12-01), Sakaguchi et al.
patent: 7205625 (2007-04-01), Nakamura et al.
patent: 7338884 (2008-03-01), Shimoto et al.
Le Thao P.
Schmeiser Olsen & Watts LLP
LandOfFree
Wafer bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4030140