Wafer bonding method

Details Wafer bonding method Wafer bonding method

2007-12-04

2007-12-04

Im, Junghwa (Department: 2811)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C438S457000, C438S458000, C438S460000, C438S050000, C438S067000, C438S051000, C438S107000, C438S125000, C257S619000, C257S723000

Reexamination Certificate

active

11126485

ABSTRACT:
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.

REFERENCES:
patent: 4315591 (1982-02-01), Houston
patent: 5150196 (1992-09-01), Yamamoto et al.
patent: 5729185 (1998-03-01), Johnson et al.
patent: 6306749 (2001-10-01), Lin
patent: 2004/0219764 (2004-11-01), Syllaios et al.
patent: 2006/0263932 (2006-11-01), Takeuchi

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