Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2008-05-13
2008-05-13
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE21518, C257SE21519
Reexamination Certificate
active
07371661
ABSTRACT:
A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.
REFERENCES:
patent: 6593211 (2003-07-01), Sato
Chang Chun-Hao
Chen Wei-Yu
Huang Guo-Shing
Liao Shih-Chieh
Zhuang Chuan-Sheng
Geyer Scott B.
Industrial Technology Research Institute
Troxell Law Office PLLC
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