Wafer bonding material with embedded rigid particles

Details Wafer bonding material with embedded rigid particles Wafer bonding material with embedded rigid particles

2006-03-28

2010-10-05

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S118000, C257SE21499, C257SE23137, C257S704000

Reexamination Certificate

active

07807547

ABSTRACT:
A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, cement or solder, for example. When the adhesive is applied and melted, and pressure is applied between the lid wafer and the device wafer, the lid wafer approaches the device wafer until a minimum separation is reached, which is defined by the rigid particles.

REFERENCES:
patent: 5293511 (1994-03-01), Poradish et al.
patent: 6062461 (2000-05-01), Sparks et al.
patent: 6368704 (2002-04-01), Murata et al.
patent: 6518097 (2003-02-01), Yim et al.
patent: 6528343 (2003-03-01), Kikuchi et al.
patent: 6584681 (2003-07-01), Lorenz et al.
patent: 6710455 (2004-03-01), Goller et al.
patent: 6802930 (2004-10-01), Chuang et al.
patent: 6844959 (2005-01-01), Huibers et al.
patent: 7462931 (2008-12-01), Summers
patent: 2002/0063321 (2002-05-01), Sauter et al.
patent: 2002/0115263 (2002-08-01), Worth et al.
patent: 2003/0054588 (2003-03-01), Patel et al.
patent: 2003/0087045 (2003-05-01), Nakata et al.
patent: 2003/0157426 (2003-08-01), Jordan et al.
patent: 2004/0087043 (2004-05-01), Lee et al.
patent: 2004/0177921 (2004-09-01), Yamauchi
patent: 2005/0006442 (2005-01-01), Stillabower
patent: 2005/0036090 (2005-02-01), Hayashi et al.
patent: 2005/0058841 (2005-03-01), Baney et al.
patent: 2005/0111797 (2005-05-01), Sherrer et al.
patent: 2005/0170656 (2005-08-01), Nasiri et al.
patent: 2007/0048898 (2007-03-01), Carlson et al.
patent: 2007/0238262 (2007-10-01), Summers
patent: 2007/0295456 (2007-12-01), Gudeman et al.
patent: 2009/0053855 (2009-02-01), Summers
patent: WO 9722993 (1997-06-01), None

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