Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-12-21
1994-06-07
Woodiel, Donald O.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
73721, 156633, 156662, B32B 3100
Patent
active
053186524
ABSTRACT:
Low temperature wafer bonding process enhancement makes a wafer surface hydrophobic, preparing it with a buffered oxide etchant and then exposing it to H.sub.2 O.sub.2 before thermoelectric bonding. Has particular application to diaphragm-based pressure sensor construction.
REFERENCES:
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4732647 (1988-03-01), Aine
patent: 4744863 (1988-05-01), Guckel et al.
patent: 5131978 (1992-07-01), O'Neill
German Publication WO-A-9 116 608 (Robert Bosch GmbH), Priority Date Apr. 14, 1990.
Wescon Conference Record-Silicon Fusion Bonding: Revolutionary New Tool for Silicon Sensors and Microstructures Dr. Kurt Petersen & Dr. Phillip Barth, Nov., 1989.
European Patent Application 0 339 981 A3, Kurt E. Peterson et al., filed Apr. 26, 1989.
European Patent Application 0 341 964 A3, H. Furubayashi, et al., filed May 5, 1989.
Patent Abstracts of Japan, No. JP 2122675 (Fuji Electric Company Limited) published on May 10, 1990.
German Publication WO-A-9009677, Guckel, et al., filed Feb. 2, 1990.
Horning Robert D.
Saathoff Deidrich J.
Stratton Thomas G.
Atlass Michael B.
Honeywell Inc.
McDowall Paul H.
Shudy Jr. John G.
Woodiel Donald O.
LandOfFree
Wafer bonding enhancement technique does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer bonding enhancement technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonding enhancement technique will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-790575